Product Description
PSA Oxygen Generator (Pressure Swing Adsorption PSA Oxygen Plants) is an ultra-high-purity oxygen supply equipment designed for the electronics industry. Based on deep pressure swing adsorption technology, it can stably produce oxygen with 99% purity through multi-stage purification and precision separation processes, featuring core advantages of small purity fluctuation, low impurity content (total hydrocarbons ≤0.1ppm), and strong continuous operation capability. As a benchmark model for psa oxygen plant purity, the 1200Nm³/h flow rate can meet the ultra-high-purity oxygen supply needs of processes such as thin film deposition and oxidation in electronic chip manufacturing, serving as a key foundational equipment to ensure chip yield.
Product Specifications
|
Oxygen Output
(Nm3/h) |
Purity
(%) |
Instrument Air Consumption
(M3/h) |
Water consumption (M3/h) |
Power consumption (KW) |
Total Power
(KW) |
Bed Layer Type |
Area (M3) |
| 50 | 90 | 10 | 3 | 32.5 | 40 | vertical | 6 x 9 |
| 150 | 90 ~ 93 | 20 | 15 | 65 | 85 | vertical | 9 x 9 |
| 200 | 90 ~ 93 | 25 | 15 | 86 | 110 | vertical | 9 x 9 |
| 300 | 90 ~ 93 | 30 | 30 | 132 | 155 | vertical | 14 x 12 |
| 400 | 90 ~ 93 | 40 | 30 | 172 | 205 | vertical | 15 x 14 |
| 600 | 90 ~ 93 | 50 | 45 | 258 | 320 | vertical | 12 x 18 |
| 800 | 90 ~ 93 | 60 | 50 | 344 | 410 | vertical | 15 x 18 |
| 1000 | 90 ~ 93 | 65 | 60 | 436 | 550 | vertical | 16 x 18 |
| 1500 | 90 ~ 93 | 90 | 90 | 675 | 845 | vertical or horizontal | 18 x 18 |
| 2000 | 90 ~ 93 | 100 | 150 | 900 | 1060 | vertical or horizontal | 18 x 24 |
Electronic chip workshops have extremely high requirements for the installation of PSA Oxygen Generator, which must meet three core standards: cleanliness, explosion protection, and pollution prevention.
- Installation area: It shall be an ISO Class 8 cleanroom, away from process areas with high dust such as lithography and etching.
- Pipeline connection: The connection between equipment and pipelines shall adopt flange sealing (PTFE gaskets), and helium mass spectrometry leak detection shall be performed (leak rate ≤1×10⁻⁹Pa・m³/s).
- Electrical system: It shall comply with the ATEX explosion-proof standard (II 2G Ex d IIB T4) to avoid safety hazards caused by electric sparks.
For maintenance, a "super-clean maintenance" process must be implemented:
- Daily maintenance: Monitor purity and pressure through a remote monitoring system; personnel are prohibited from entering the core area of the equipment.
- Regular maintenance (monthly): Replace the pre-filter element in a clean glove box to avoid external contamination.
- In-depth maintenance (annual): Conducted by professional teams from psa oxygen generator manufacturers, including molecular sieve performance testing, catalyst activity evaluation, and pipeline inner wall cleanliness detection. Maintenance personnel must wear clean suits and enter through an air shower to ensure no particles are brought in.
Special attention: The replacement of ultra-high-purity molecular sieves and catalysts must strictly follow the "inert gas protection" process to prevent performance degradation due to contact with air. After replacement, a 24-hour purity test shall be conducted, and the equipment can only be put into use after confirming compliance with standards. Such strict maintenance standards can ensure the equipment’s service life exceeds 10 years, with purity consistently stable above 99%.
With its 1200Nm³/h flow rate and 99% ultra-high purity, the PSA Oxygen Generator has become a core oxygen supply equipment for electronic chip manufacturing. Its pressure swing adsorption psa oxygen plants technology provides stable and clean oxygen guarantee for chip processes, serving as an important support for the high-quality development of the electronic information industry.
Product Tags:
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1200 Nm³/h 99% High-Purity PSA Oxygen Generator for Electronic Chip Manufacturing with Pressure Swing Adsorption Technology Images
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